Electronics Materials
Protection and shielding materials for electronic assemblies operating in demanding defense, aerospace, and industrial environments.
What We Source
- Conformal coatings (acrylic, silicone, polyurethane, epoxy, parylene)
- Encapsulants and potting compounds
- Underfill materials for flip-chip/BGA
- EMI/RFI shielding materials (gaskets, coatings, tapes)
- Thermally conductive encapsulants
- Die attach adhesives
- Glob top and dam-and-fill materials
- Board-level coating materials
Common Specifications
- Electrical properties (dielectric constant, volume resistivity)
- Environmental resistance (humidity, salt spray, temperature cycling)
- Cure conditions and processing requirements
- Viscosity and flow characteristics
- Thermal properties (conductivity, Tg)
Typical Documentation
- Safety Data Sheets (SDS)
- Certificate of Analysis (CoA)
- Processing parameters and guidelines
- Qualification test reports
- Shelf life and storage requirements
Lead Time & Availability
Standard products: 2-4 weeks. Specialty formulations or large quantities: 6-12 weeks. Some high-reliability grades have longer lead times.
MOQ Considerations
Available in various package sizes from syringes to pails. Smaller trial quantities usually available. Production quantities have better pricing.
Compliance Notes
- Materials for defense electronics may require end-use awareness
- RoHS/REACH compliance critical for most applications
- We work with suppliers meeting MIL and IPC standards
- Qualification data available for established products
Ready to Source Electronics Materials?
Submit your requirements and receive a detailed quotation with realistic lead times and documentation commitments.