Thermal Management
Heat dissipation and thermal interface solutions for electronics cooling, power management, and temperature-critical applications.
What We Source
- Thermal interface materials (TIMs) - greases, pads, compounds
- Graphite sheets and thermal spreaders
- Phase change materials (PCMs)
- Gap fillers and gap pads
- Thermally conductive adhesives
- Heat sinks (extruded, machined, die-cast)
- Thermal tapes and films
- Pyrolytic graphite sheets (PGS)
Common Specifications
- Thermal conductivity (W/m·K)
- Thermal impedance / resistance
- Operating temperature range
- Thickness and compressibility
- Electrical properties (insulating vs. conductive)
Typical Documentation
- Technical Data Sheets with thermal performance
- Certificate of Analysis (CoA)
- Safety Data Sheets (SDS) where applicable
- Application and assembly guidelines
- Reliability test data
Lead Time & Availability
Standard products from distribution: 1-4 weeks. Custom die-cut or machined forms: 4-8 weeks. High-performance materials may have longer lead times.
MOQ Considerations
Sheet materials have minimum order quantities. Standard pads/compounds available in smaller quantities. Custom configurations have setup minimums.
Compliance Notes
- Most thermal materials are not export controlled
- RoHS/REACH compliance important for electronics applications
- We provide compliance documentation where available
- Specialty high-performance materials may have restrictions
Ready to Source Thermal Management?
Submit your requirements and receive a detailed quotation with realistic lead times and documentation commitments.